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ASML's magic uncovered: Tech and partners behind EUV edge China can't replicate

India, Nov. 12 -- While China is racing to close the lithography gap with homegrown tools from Huawei-linked SiCarrier and Yuliangsheng, the reality is that extreme ultraviolet (EUV) lithography remai... Read More


All EU countries join Semicon Coalition to secure technological leadership

India, Nov. 12 -- From artificial intelligence to critical infrastructure and defense: semiconductors power the technologies that define our future in terms of prosperity, innovation, resilience and c... Read More


Top 10 semiconductor trends expected in 2026

India, Nov. 11 -- StartUs Insights has published its findings on: What are the Top 10 Semiconductor Technology Trends in 2026 and Beyond? These are as follows: AI Compute and Custom Silicon: Cloud a... Read More


Microchip expands India footprint with new office facility in Bengaluru

India, Nov. 11 -- Microchip Technology has expanded its India footprint with the acquisition of 1.72 lakh square feet (16,000 square meters) of premium office space at the Export Promotion Industrial ... Read More


Karnataka Startup Policy 2025-2030 announced

India, Nov. 11 -- Karnataka State Cabinet has approved the new Karnataka Startup Policy 2025-2030. This policy aims to establish up to 25,000 startups, including 10,000 outside Bengaluru, over the nex... Read More


European sales of semiconductors up 7.2% QoQ in the last quarter

India, Nov. 10 -- European Semiconductor Industry Association (ESIA) announced that European sales of semiconductors grew steadily in the third quarter of 2025 compared to the second quarter. Sales r... Read More


Worldwide silicon wafer shipments increase 3% year-on-year in Q3-2025

India, Nov. 10 -- SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 3.1% year-on-year to 3,313 m... Read More


Siemens updates Designcenter Solid Edge with AI and cloud-driven enhancements

India, Nov. 10 -- Siemens Digital Industries Software has announced the latest updates to its Designcenter Solid Edge software, including new capabilities in AI and improvements in productivity, docum... Read More


Glass core substrates and interposers: New growth engines for glass in advanced packaging for AI and HPC

India, Nov. 10 -- Yole Group's new report, Glass Materials for Advanced Packaging 2025, covers how glass has evolved from a standard wafer carrier to a key piece on the board of next-generation AI eng... Read More


SiCarrier subsidiaries reportedly launch China's fully-independent EDA, 3nm test equipment

India, Nov. 10 -- According to ijiwei, citing Yicai, Qiyunfang, a subsidiary of SiCarrier-a fast-rising Chinese semiconductor equipment firm reportedly linked to Huawei-has unveiled two domestically d... Read More